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  6. 3M™ Low-Static Polyimide Film Tape 7419, NSNF, 610 mm x 33 m, 1 Roll/Case

3M™ Low-Static Polyimide Film Tape 7419, NSNF, 610 mm x 33 m, 1 Roll/Case

  • 3M ID 7100382229
  • UPC 50068060477144

Silicone-free acrylic adhesive is resistant to typical solder mask temperatures for short periods of time

Offers clean removal from substrates like FR-4 and gold

Stays firmly in place during processing and removes cleanly from typical electronic substrates, even after 10 minutes at 260°C (500°F)

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Öne Çıkanlar
  • Silicone-free acrylic adhesive is resistant to typical solder mask temperatures for short periods of time
  • Offers clean removal from substrates like FR-4 and gold
  • Stays firmly in place during processing and removes cleanly from typical electronic substrates, even after 10 minutes at 260°C (500°F)
  • High-temperature adhesive has excellent chemical resistance for demanding chemical masking applications
  • Maintains static dissipative properties to protect sensitive components
  • Wound on a polyethylene tape core

3M™ Low-Static Polyimide Film Tape 7419 is a high-temperature tape for electronic applications. With a silicone-free adhesive, it withstands short-term exposure to typical solder mask temperatures and provides clean removal, helping minimise contamination risks.

Delivering performance in electronics applications, 3M™ Low-Static Polyimide Film Tape 7419 is engineered for high-temperature conditions. This soldering masking tape features a specially formulated acrylic adhesive, helping ensure robust adhesion during short exposure to elevated solder mask temperatures while providing clean removal from common substrates such as FR-4, gold and silicon. Its non-silicone adhesive composition helps reduce the risk of contamination, making it an ideal choice for powder coat masking tasks. The tape's low static dissipative properties allow for use in static-sensitive environments. Known for its high tensile strength, this tape performs in demanding chemical masking situations and offers a reliable, clean solution to help keep substrates safe from heat and chemical exposure during critical stages of electronic manufacturing processes.

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